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Hlavní stránka>IEC 61189-2-803:2023 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
sklademVydáno: 2023-07-26
IEC 61189-2-803:2023 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

IEC 61189-2-803:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-803: Méthodes d'essai pour la dilatation suivant l'axe Z des matériaux de base et des cartes imprimées

Formát
Dostupnost
Cena a měna
Anglicky/Francouzsky Tisk
skladem
572 Kč
Anglicky/Francouzsky PDF
K okamžitému stažení
572 Kč
Označení normy:IEC 61189-2-803:2023
Vydáno:2023-07-26
Jazyk:Anglicky/Francouzsky
Popis

IEC 61189-2-803:2023

IEC 61189-2-803:2023 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA).