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sklademVydáno: 2023-05-11
IEC 61249-2-51:2023
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
Matériaux pour circuits imprimés et autres structures d’interconnexion - Partie 2-51: Matériaux de base renforcés, plaqués et non plaqués - Matériaux de base pour bande support de carte à circuit intégré, non plaqués
Formát
Dostupnost
Cena a měna
Anglicky/Francouzsky Tisk
skladem
3289 Kč
Anglicky/Francouzsky PDF
K okamžitému stažení
3289 Kč
| Označení normy: | IEC 61249-2-51:2023 |
| Vydáno: | 2023-05-11 |
| Jazyk: | Anglicky/Francouzsky |
Popis
IEC 61249-2-51:2023
IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials). This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.