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Hlavní stránka>IEC 62769-6:2023 - Field Device Integration (FDI®) - Part 6: FDI Technology Mappings
sklademVydáno: 2023-04-06
IEC 62769-6:2023 - Field Device Integration (FDI®) - Part 6: FDI Technology Mappings

IEC 62769-6:2023

Field Device Integration (FDI®) - Part 6: FDI Technology Mappings

Intégration des appareils de terrain (FDI®) - Partie 6: Mappings de technologies FDI

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Anglicky/Francouzsky Tisk
skladem
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Anglicky/Francouzsky PDF
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Označení normy:IEC 62769-6:2023
Vydáno:2023-04-06
Jazyk:Anglicky/Francouzsky
Popis

IEC 62769-6:2023

IEC 62769-6:2023 is available as IEC 62769-6:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-6:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®[1]) standard. The technology mapping focuses on implementation of the components FDI® Client and User Interface Plug-in (UIP) in the specified technologies for the WORKSTATION platform and the MOBILE platform as defined in IEC 62769-4. There are individual subparts for the currently supported technologies .NET and HTML5.