Cena s DPH / bez DPH
31.190 Sestavy elektronických součástek
Měna
Cena s DPH / bez DPH
Cena s DPH
Anglicky Zabezpečené PDF
K okamžitému stažení
4898 Kč
Anglicky Tisk
Skladem
4898 Kč
BS EN 62137-1-3:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
Vydáno: 2009-03-31
Anglicky Zabezpečené PDF
K okamžitému stažení
6820 Kč
Anglicky Tisk
Skladem
6820 Kč
Anglicky Zabezpečené PDF
K okamžitému stažení
9486 Kč
Anglicky Tisk
Skladem
9486 Kč
BS EN 61190-1-1:2002
Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Vydáno: 2002-08-16
Anglicky Zabezpečené PDF
K okamžitému stažení
6820 Kč
Anglicky Tisk
Skladem
6820 Kč
BS EN 61188-1-1:1997
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies
Vydáno: 1997-12-15
Anglicky Zabezpečené PDF
K okamžitému stažení
4154 Kč
Anglicky Tisk
Skladem
4154 Kč
BS EN 61193-1:2002
Quality assessment systems Registration and analysis of defects on printed board assemblies
Quality assessment systems Registration and analysis of defects on printed board assemblies
Vydáno: 2002-05-14
Anglicky Zabezpečené PDF
K okamžitému stažení
6820 Kč
Anglicky Tisk
Skladem
6820 Kč
PD IEC/TS 62878-2-4:2015
Device embedded substrate Guidelines. Test element groups (TEG)
Device embedded substrate Guidelines. Test element groups (TEG)
Vydáno: 2015-04-30
Anglicky Zabezpečené PDF
K okamžitému stažení
7998 Kč
Anglicky Tisk
Skladem
7998 Kč
BS EN 62137-1-4:2009
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic bending test
Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic bending test
Vydáno: 2009-03-31
Anglicky Zabezpečené PDF
K okamžitému stažení
4898 Kč
Anglicky Tisk
Skladem
4898 Kč
BS EN IEC 62878-2-5:2019
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
Vydáno: 2019-11-18
Anglicky Zabezpečené PDF
K okamžitému stažení
9486 Kč
Anglicky Tisk
Skladem
9486 Kč
Anglicky Zabezpečené PDF
K okamžitému stažení
8990 Kč
Anglicky Tisk
Skladem
8990 Kč
BS EN IEC 61188-6-1:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards
Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards
Vydáno: 2021-04-07
Anglicky Zabezpečené PDF
K okamžitému stažení
7998 Kč
Anglicky Tisk
Skladem
7998 Kč
BS EN IEC 60068-2-21:2021
Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices
Vydáno: 2021-09-13
Anglicky Zabezpečené PDF
K okamžitému stažení
8990 Kč
Anglicky Tisk
Skladem
8990 Kč