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Hlavní stránka>UNE EN 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods -- Part 20-1: Handling, packing, labelling and shipping of surface mount devices sensitive to the combined effect of moisture and soldering heat (Endorsed by AENOR in September of 2009.)
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sklademVydáno: 2009-09-01
UNE EN 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods -- Part 20-1: Handling, packing, labelling and shipping of surface mount devices sensitive to the combined effect of moisture and soldering heat (Endorsed by AENOR in September of 2009.)

UNE EN 60749-20-1:2009

Semiconductor devices - Mechanical and climatic test methods -- Part 20-1: Handling, packing, labelling and shipping of surface mount devices sensitive to the combined effect of moisture and soldering heat (Endorsed by AENOR in September of 2009.)

Dispositivos de semiconductores. Métodos de ensayo mecánicos y climáticos. Parte 20-1: Manejo, empaquetado, etiquetado y transporte de los dispositivos con montaje en superficie que son sensibles a los efectos combinados de la humedad y al calentamiento de soldado. (Ratificada por AENOR en septiembre de 2009.)

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Označení normy:UNE EN 60749-20-1:2009
Počet stran:35
Vydáno:2009-09-01
Status:Norma
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This standard UNE EN 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods -- Part 20-1: Handling, packing, labelling and shipping of surface mount devices sensitive to the combined effect of moisture and soldering heat (Endorsed by AENOR in September of 2009.) is classified in these ICS categories:

  • 31.080.01
:
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