Cena s DPH / bez DPH
Hlavní stránka>UNE EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Endorsed by AENOR in June of 2012.)
Sponsored link
sklademVydáno: 2012-06-01
UNE EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Endorsed by AENOR in June of 2012.)

UNE EN 62047-9:2011

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Endorsed by AENOR in June of 2012.)

Dispositivos semiconductores. Dispositivos micro-electromecánicos. Parte 9: Medida de la resistencia de la unión oblea a oblea para NEMS. (Ratificada por AENOR en junio de 2012.)

Formát
Dostupnost
Cena a měna
Anglicky PDF
K okamžitému stažení
2099 Kč
Anglicky Tisk
Skladem
2099 Kč
Označení normy:UNE EN 62047-9:2011
Počet stran:29
Vydáno:2012-06-01
Status:Norma
Popis

This standard UNE EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Endorsed by AENOR in June of 2012.) is classified in these ICS categories:

  • 31.080.99
: